The gold-tin intermetallics layer is responsible for poor mechanical reliability of tin-soldered gold-plated surfaces where the gold plating did not completely dissolve in the solder.

For the press-fit design, the compliant tail of the socket features precision-machined pins that are hollow and slotted to conform to the PCB holes. Sections : 2 PCB Mount Orientation : Vertical Contact Features Contact Mating Area Plating Material : Nickel (Ni) Mating Pin Diameter : 1.5 MM [.059 INCH, Description:

.46] dia. The two principal types of flux are acid flux (sometimes called "active flux"), containing strong acids, used for metal mending and plumbing, and rosin flux (sometimes called "passive flux"), used in electronics.

Sockets Compatible with TO-5, TO-8, TO-18, TO-39, and TO-46 Photodiode Packages; Offered in Solder-Tail or Pass-Through Receptacle Designs; STO Photodiode Sockets Use FR4-PCB Base [3.18 mm (0.125") Thick] Thorlabs offers a variety of photodiode sockets compatible with … Dissolving of process equipment is not common as the materials are usually chosen to be insoluble in solder.[25].

Semiconductor parts with 673 in root number, Page 7. Slide Switches -- 1571600-1, PC Card Connectors -

Thorlabs' photodiode sockets are compatible with our Unmounted Photodiodes, Pigtailed Photodiodes, and Calibrated Photodiodes. CA Privacy Rights: Do Not Sell My Personal Information, Credit account for qualified institutions and businesses, *Shipping features do not apply to Marketplace products.

#!" PCB hole dia. The temperature of total solidification is the solidus of the alloy, the temperature at which all components are molten is the liquidus. If the soldering time is long enough to form the intermetallics, the tin surface of a joint soldered to gold is very dull.[13].

Although lead water pipes were displaced by copper when the significance of lead poisoning began to be fully appreciated, lead solder was still used until the 1980s because it was thought that the amount of lead that could leach into water from the solder was negligible from a properly soldered joint.

Many methods are used to manufacture the solder preform, stamping being the most common.

Board to Board Connectors -

This had the advantage of making the alloy solidify more slowly. Much recent research has focused on the addition of a fourth element to Sn-Ag-Cu solder, in order to provide compatibility for the reduced cooling rate of solder sphere reflow for assembly of ball grid arrays. In hand soldering of electronics it may be detrimental as the joint may appear solidified while it is not yet.

h�|��JA�_%o��$��@�A�"H�Vz(v�^��iA���vE�ӟ@��a � P�� I���00�рGM"�dT0쩝C4PN�0����8�.�ti�����?��?�ݦ��z~� x�_�>jy����^}���mgbv�t7Ow�t7Ow�t7Ow�9w�ݭ������s��WJP,�~���S�� R�����C��E�r�+�xY���h�Ƹa�Rl�(^���x��|0 ({� The solid-state reactions are more complex – the formation of intermetallics can be inhibited by changing the composition of the base metal or the solder alloy, or by using a suitable barrier layer to inhibit diffusion of the metals.[29].

Solder is melted in order to adhere to and connect the pieces after cooling, which requires that an alloy suitable for use as solder have a lower melting point than the pieces being joined.

They are almost exclusively used today in consumer electronics.[4]. New products are added daily, so check back frequently. Board and Wire Connectors, IC Interconnect Components - Indicates content that may require registration and/or purchase.

SOLDER TAIL SWAGE PIN, Description:

Since even small amounts of lead have been found detrimental to health as a potent neurotoxin,[11] lead in plumbing solder was replaced by silver (food-grade applications) or antimony, with copper often added, and the proportion of tin was increased (see Lead-free solder. Alloys of lead and tin were commonly used in the past and are still available; they are particularly convenient for hand-soldering. Flux that is compatible with these sockets are provided in Figure 5. Use of this website signifies your agreement to our Terms of Use.

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Flux is also used to prevent joints from desoldering. Tin-rich solders also readily dissolve silver; for soldering silver metallization or surfaces, alloys with addition of silvers are suitable; tin-free alloys are also a choice, though their wettability is poorer.

Review available materials, capabilities, and pricing from various board houses. These sockets are open at the end and allow leads to pass directly through the socket, eliminating the need to cut the diode leads, which could damage the device. Micro SSO Series Strip Connectors - Dual Row Offset Flex, Automotive Electrical Connectors -

Operation is as simple as placing a diode onto the two rollers at the front of the device, lightly applying pressure with the rubber covered grips, and turning the blade actuator (as shown in the image to the right). The alloys used for these purposes contain a high proportion of silver (up to 40%), and may also contain cadmium.

Non-eutectic compositions on cooling start to first precipitate the non-eutectic phase; dendrites when it is a metal, large crystals when it is an intermetallic compound. Browse our library of Another Geek Moment, New Product Discoveries, Another Teaching Moment, Digi-Key Daily, and Tutorial videos. Designed to Remove Cans from Standard Photodiode Packages. The usual temperature of achieving flowing and wetting is between 450 and 550 °C (840 and 1,020 °F).

These Swiss Preci-dip IC Pin Connectors are Low Profile solder tail Through Hole or SMD PCB headers. BOARD-BOARD CONN, HEADER, 72WAY, 2ROW -- 91C5832, Board to Board Connectors -

For electrical and electronics work, solder wire is available in a range of thicknesses for hand-soldering (manual soldering is performed using a soldering iron or soldering gun), and with cores containing flux. Two processes play a role in a solder joint formation: interaction between the substrate and molten solder, and solid-state growth of intermetallic compounds.

Water soluble fluxes are generally more conductive than traditionally used electrical / electronic fluxes and so have more potential for electrically interacting with a circuit; in general it is important to remove their traces after soldering. Due to concerns over atmospheric pollution and hazardous waste disposal, the electronics industry has been gradually shifting from rosin flux to water-soluble flux, which can be removed with deionized water and detergent, instead of hydrocarbon solvents.

Intermetallics are often hard and brittle. These durable light weight connectors are suitable for the most demanding applications. Non-eutectic mixtures often exist as a paste of solid particles in a melted matrix of the lower-melting phase as they approach high enough temperatures. The glass solder has to flow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the joined materials or nearby structures (e.g., metallization layers on chips or ceramic substrates) occurs. PGA / BGA / PLCC - PLCC SOLDER TAIL 540-88-032-24-000-1 NEWS Home About Us Products Technical Assistance Distributors & Reps Distributors Login Contact Us Job Opportunities Newsletters << Back To Search Results Series 540 PGA / BGA / PLCC - PLCC solder tail PLCC Socket for Plastic Leaded Chip Carrier (PLCC), Solder tail

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Solder is melted in order to adhere to and connect the pieces after cooling, which requires that an alloy suitable for use as solder have a lower melting point than the pieces being joined.

The remaining solder types are used in decreasing order of hardness during the process of making an item, to prevent a previously soldered seam or joint desoldering while additional sites are soldered. Terminals - PC, IC Interconnect Components - DOUBLE TAIL HEADER PIN ON KAPTON, Description:

The word solder comes from the Middle English word soudur, via Old French solduree and soulder, from the Latin solidare, meaning "to make solid".[5].

PCB Pins and Receptacles - Such a mixture of solid particles in a molten eutectic is referred to as a mushy state.

Tin-silver-copper (Sn-Ag-Cu, or "SAC") solders are used by two-thirds of Japanese manufacturers for reflow and wave soldering, and by about 75% of companies for hand soldering.

Tail, Description: The greater the tin concentration, the greater the solder’s tensile and shear strengths. Semiconductor parts with 732 in root number, Page 30. Description Panel mount: Snap-in version, from front side Connector, LEMO’s new HARPOON: Press fit contacts for elbow and straight, graphics. Digi-Key Marketplace is your access to millions of new products and services from new suppliers all on one website.

Dual Row Right Angle Connector Series, IC Sockets and Headers -

Lock/Eject DIP Collet Sockets with, PCB Pins and Receptacles - : Printed Circuit Board PCB Connector Assembly Type : PCB Mount Header Termination Features Square Termination Post & Tail Dimension : .64 MM [.025 INCH. The WR1 is a hand-held device designed to remove the cans from standard laser packages. test lead NORMAL FORCE: 45g/pin, based on 0.018 [0.46] dia.

Digi-Key carries a broad line of Industrial Automation, Control and Safety products from some of the most recognized and trusted industry suppliers.

Solder (/ ˈ s oʊ l d ər /, / ˈ s ɒ l d ər / or in North America / ˈ s ɒ d ər /) is a fusible metal alloy used to create a permanent bond between metal workpieces.

Dual In Line Socket, Long Solder Tail for Multilayer PC-Boards, Open Frame DIP sockets with increased solder tail, allowing application on multilayer PCBs up to .139 " (No Suggestions), 4-finger BeCu #30 clip, Description:



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